Sheet absorbing material modeling and application for enclosures

Andriy Radchenko, Joseph Bishop, Richard Johnson, Paul Dixon, Marina Koledintseva, Roman Jobava, David Pommerenke, James Drewniak

Research output: Chapter in Book/Report/Conference proceedingConference paper

Abstract

This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.

Original languageEnglish
Title of host publicationProceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
Pages645-650
Number of pages6
DOIs
Publication statusPublished - 1 Dec 2013
Externally publishedYes
Event2013 IEEE International Symposium on Electromagnetic Compatibility: EMC 2013 - Denver, United States
Duration: 5 Aug 20139 Aug 2013

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2013 IEEE International Symposium on Electromagnetic Compatibility
CountryUnited States
CityDenver
Period5/08/139/08/13

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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