Sheet absorbing material modeling and application for enclosures

Andriy Radchenko, Joseph Bishop, Richard Johnson, Paul Dixon, Marina Koledintseva, Roman Jobava, David Pommerenke, James Drewniak

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

This paper demonstrates relevant physics and provides recommendations regarding thin sheet absorber material applications in enclosures of electronic circuitry. Sheet absorbers placed on the walls of an enclosure are studied herein both experimentally and through the full-wave numerical simulations. In practical applications, the applied absorbing patches need to be selected in terms of proper material type, thickness, size, and placement within an enclosure. The goal is to achieve the maximum effectiveness to suppress electromagnetic field at problem resonances in the enclosure.

Originalspracheenglisch
TitelProceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
Seiten645-650
Seitenumfang6
DOIs
PublikationsstatusVeröffentlicht - 1 Dez 2013
Extern publiziertJa
Veranstaltung2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013 - Denver, CO, USA / Vereinigte Staaten
Dauer: 5 Aug 20139 Aug 2013

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Konferenz

Konferenz2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
LandUSA / Vereinigte Staaten
OrtDenver, CO
Zeitraum5/08/139/08/13

ASJC Scopus subject areas

  • !!Condensed Matter Physics
  • !!Electrical and Electronic Engineering

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