Powered system-level conductive TLP probing method for ESD/EMI hard fail and soft fail threshold evaluation

Thomas Schwingshackl, Benjamin Orr, Joost Willemen, Werner Simbürger, Harald Gossner, Wolfgang Bösch, David Pommerenke

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper an advanced system-level TLP probing technique is presented to evaluate the ESD and EMI performance of a powered system applicable to high speed interfaces. It allows to detect hardware and software fail thresholds to assess the performance of an ESD/EMI protection solution. The method is demonstrated on a Intel mobile phone reference platform.

Original languageEnglish
Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013
Publication statusPublished - 16 Oct 2013
Event2013 35th Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2013 - Las Vegas, NV, United States
Duration: 8 Sep 201313 Sep 2013

Publication series

NameElectrical Overstress/Electrostatic Discharge Symposium Proceedings
ISSN (Print)0739-5159

Conference

Conference2013 35th Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD 2013
CountryUnited States
CityLas Vegas, NV
Period8/09/1313/09/13

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Schwingshackl, T., Orr, B., Willemen, J., Simbürger, W., Gossner, H., Bösch, W., & Pommerenke, D. (2013). Powered system-level conductive TLP probing method for ESD/EMI hard fail and soft fail threshold evaluation. In Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013 [6635924] (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).