Investigation of Electrostatic Discharge-Induced Soft-Failure Using 3D Robotic Scanning

Omid Hoseini Izadi, David Pommerenke, Hideki Shumiya, Kenji Araki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A robotic ESD scanning system is presented for scanning complex 3D objects. It provides pseudo-2D plots that illustrate the sensitive locations of the device under test on a relative scale. Using this system, we could determine the susceptible regions of the device. It was observed that disturbing different sensitive regions lead to different soft-failure types. Determining the sensitive locations of a complex-shaped DUT helps to identify the disturbed circuitry and verify the effect of countermeasures in a repeatable way.

Original languageEnglish
Title of host publication2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
PublisherInstitute of Electrical and Electronics Engineers
Pages173-177
Number of pages5
ISBN (Electronic)9781538691991
DOIs
Publication statusPublished - 1 Jul 2019
Externally publishedYes
Event2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 - New Orleans, United States
Duration: 22 Jul 201926 Jul 2019

Publication series

Name2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Conference

Conference2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
CountryUnited States
CityNew Orleans
Period22/07/1926/07/19

Keywords

  • electrostatic discharge
  • robot
  • soft-failure
  • system level ESD

ASJC Scopus subject areas

  • Signal Processing
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Izadi, O. H., Pommerenke, D., Shumiya, H., & Araki, K. (2019). Investigation of Electrostatic Discharge-Induced Soft-Failure Using 3D Robotic Scanning. In 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (pp. 173-177). [8825248] (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISEMC.2019.8825248