Investigation of Electrostatic Discharge-Induced Soft-Failure Using 3D Robotic Scanning

Omid Hoseini Izadi, David Pommerenke, Hideki Shumiya, Kenji Araki

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem Konferenzband

Abstract

A robotic ESD scanning system is presented for scanning complex 3D objects. It provides pseudo-2D plots that illustrate the sensitive locations of the device under test on a relative scale. Using this system, we could determine the susceptible regions of the device. It was observed that disturbing different sensitive regions lead to different soft-failure types. Determining the sensitive locations of a complex-shaped DUT helps to identify the disturbed circuitry and verify the effect of countermeasures in a repeatable way.

Originalspracheenglisch
Titel2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten173-177
Seitenumfang5
ISBN (elektronisch)9781538691991
DOIs
PublikationsstatusVeröffentlicht - 1 Jul 2019
Extern publiziertJa
Veranstaltung2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 - New Orleans, USA / Vereinigte Staaten
Dauer: 22 Jul 201926 Jul 2019

Publikationsreihe

Name2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Konferenz

Konferenz2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
LandUSA / Vereinigte Staaten
OrtNew Orleans
Zeitraum22/07/1926/07/19

ASJC Scopus subject areas

  • !!Signal Processing
  • !!Energy Engineering and Power Technology
  • !!Electrical and Electronic Engineering
  • !!Safety, Risk, Reliability and Quality

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