Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer; Christian Mentin; Michael Rindler; Franz Vollmaier; Alexander Connaughton; Klaus Krischan

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer^*, Christian Mentin, Michael Rindler, Franz Vollmaier, Alexander Connaughton, Klaus Krischan

^*Korrespondierende/r Autor/-in für diese Arbeit

Publikation: Konferenzbeitrag › Paper › Begutachtung

Originalsprache	englisch
Seiten	1-6
Seitenumfang	6
Publikationsstatus	Veröffentlicht - 27 Sept. 2019
Veranstaltung	International Workshop Thermal Investigation of ICs and Systems: Therminic - Politecnico di Milano – Polo di Lecco Campus, Lecco, Italien Dauer: 25 Sept. 2019 → 27 Sept. 2019 Konferenznummer: 25 https://therminic2019.eu/

Konferenz

Konferenz	International Workshop Thermal Investigation of ICs and Systems
Kurztitel	Therminic 2019
Land/Gebiet	Italien
Ort	Lecco
Zeitraum	25/09/19 → 27/09/19
Internetadresse	https://therminic2019.eu/

Zugriff auf Dokument

https://ieeexplore.ieee.org/document/8923595

1 Vortrag bei Konferenz oder Fachtagung

Gekoppelte elektro-thermische Simulation: Methodik zur Entwicklung eines bidirektionalen Onboard Chargers mit hoher Leistungsdichte
Thomas Rainer Langbauer (Redner/in), Alexander Michael Connaughton (Beitragende/r), Franz Vollmaier (Beitragende/r), Christian Mentin (Beitragende/r), Michael Rindler (Beitragende/r), Rudolf Krall (Beitragende/r) & Klaus Krischan (Beitragende/r)
13 Feb. 2020
Aktivität: Vortrag oder Präsentation › Vortrag bei Konferenz oder Fachtagung › Science to science

Dieses zitieren

Langbauer, T. R., Mentin, C., Rindler, M., Vollmaier, F., Connaughton, A., & Krischan, K. (2019). Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.. 1-6. Beitrag in International Workshop Thermal Investigation of ICs and Systems, Lecco, Italien. https://ieeexplore.ieee.org/document/8923595

Langbauer, TR, Mentin, C, Rindler, M, Vollmaier, F , Connaughton, A & Krischan, K 2019, 'Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.', Beitrag in International Workshop Thermal Investigation of ICs and Systems, Lecco, Italien, 25/09/19 - 27/09/19 S. 1-6. <https://ieeexplore.ieee.org/document/8923595>

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title = "Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.",

author = "Langbauer, {Thomas Rainer} and Christian Mentin and Michael Rindler and Franz Vollmaier and Alexander Connaughton and Klaus Krischan",

year = "2019",

month = sep,

day = "27",

language = "English",

pages = "1--6",

note = "International Workshop Thermal Investigation of ICs and Systems : Therminic, Therminic 2019 ; Conference date: 25-09-2019 Through 27-09-2019",

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TY - CONF

T1 - Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

AU - Langbauer, Thomas Rainer

AU - Mentin, Christian

AU - Rindler, Michael

AU - Vollmaier, Franz

AU - Connaughton, Alexander

AU - Krischan, Klaus

N1 - Conference code: 25

PY - 2019/9/27

Y1 - 2019/9/27

M3 - Paper

SP - 1

EP - 6

T2 - International Workshop Thermal Investigation of ICs and Systems

Y2 - 25 September 2019 through 27 September 2019

ER -

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Konferenz

Zugriff auf Dokument

Aktivitäten

Gekoppelte elektro-thermische Simulation: Methodik zur Entwicklung eines bidirektionalen Onboard Chargers mit hoher Leistungsdichte

Dieses zitieren