Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Research output: Contribution to conferencePaperResearchpeer-review

Original languageEnglish
Pages1-6
Number of pages6
Publication statusPublished - 27 Sep 2019
EventInternational Workshop Thermal Investigation of ICs and Systems: Therminic - Politecnico di Milano – Polo di Lecco Campus, Lecco, Italy
Duration: 25 Sep 201927 Sep 2019
Conference number: 25
https://therminic2019.eu/

Conference

ConferenceInternational Workshop Thermal Investigation of ICs and Systems
Abbreviated titleTherminic 2019
CountryItaly
CityLecco
Period25/09/1927/09/19
Internet address

Cite this

Langbauer, T. R., Mentin, C., Rindler, M., Vollmaier, F., Connaughton, A., & Krischan, K. (2019). Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.. 1-6. Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy.