Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Research output: Contribution to conferencePaperResearchpeer-review

Original languageEnglish
Pages1-6
Number of pages6
Publication statusUnpublished - 27 Sep 2019
EventInternational Workshop Thermal Investigation of ICs and Systems: Therminic - Politecnico di Milano – Polo di Lecco Campus, Lecco, Italy
Duration: 25 Sep 201927 Sep 2019
Conference number: 25
https://therminic2019.eu/

Conference

ConferenceInternational Workshop Thermal Investigation of ICs and Systems
Abbreviated titleTherminic 2019
CountryItaly
CityLecco
Period25/09/1927/09/19
Internet address

Cite this

Langbauer, T. R., Mentin, C., Rindler, M., Vollmaier, F., Connaughton, A., & Krischan, K. (2019). Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.. 1-6. Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy.

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions. / Langbauer, Thomas Rainer; Mentin, Christian; Rindler, Michael; Vollmaier, Franz; Connaughton, Alexander; Krischan, Klaus.

2019. 1-6 Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy.

Research output: Contribution to conferencePaperResearchpeer-review

Langbauer, TR, Mentin, C, Rindler, M, Vollmaier, F, Connaughton, A & Krischan, K 2019, 'Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.' Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy, 25/09/19 - 27/09/19, pp. 1-6.
Langbauer TR, Mentin C, Rindler M, Vollmaier F, Connaughton A, Krischan K. Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.. 2019. Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy.
@conference{4895daf9486e41458d7316d173ad6024,
title = "Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.",
author = "Langbauer, {Thomas Rainer} and Christian Mentin and Michael Rindler and Franz Vollmaier and Alexander Connaughton and Klaus Krischan",
year = "2019",
month = "9",
day = "27",
language = "English",
pages = "1--6",
note = "International Workshop Thermal Investigation of ICs and Systems : Therminic, Therminic 2019 ; Conference date: 25-09-2019 Through 27-09-2019",
url = "https://therminic2019.eu/",

}

TY - CONF

T1 - Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

AU - Langbauer, Thomas Rainer

AU - Mentin, Christian

AU - Rindler, Michael

AU - Vollmaier, Franz

AU - Connaughton, Alexander

AU - Krischan, Klaus

PY - 2019/9/27

Y1 - 2019/9/27

M3 - Paper

SP - 1

EP - 6

ER -