Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer; Christian Mentin; Michael Rindler; Franz Vollmaier; Alexander Connaughton; Klaus Krischan

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Thomas Rainer Langbauer^*, Christian Mentin, Michael Rindler, Franz Vollmaier, Alexander Connaughton, Klaus Krischan

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

Original language	English
Pages	1-6
Number of pages	6
Publication status	Published - 27 Sept 2019
Event	International Workshop Thermal Investigation of ICs and Systems: Therminic - Politecnico di Milano – Polo di Lecco Campus, Lecco, Italy Duration: 25 Sept 2019 → 27 Sept 2019 Conference number: 25 https://therminic2019.eu/

Conference

Conference	International Workshop Thermal Investigation of ICs and Systems
Abbreviated title	Therminic 2019
Country/Territory	Italy
City	Lecco
Period	25/09/19 → 27/09/19
Internet address	https://therminic2019.eu/

Access to Document

https://ieeexplore.ieee.org/document/8923595

1 Talk at conference or symposium

Gekoppelte elektro-thermische Simulation: Methodik zur Entwicklung eines bidirektionalen Onboard Chargers mit hoher Leistungsdichte
Thomas Rainer Langbauer (Speaker), Alexander Michael Connaughton (Contributor), Franz Vollmaier (Contributor), Christian Mentin (Contributor), Michael Rindler (Contributor), Rudolf Krall (Contributor) & Klaus Krischan (Contributor)
13 Feb 2020
Activity: Talk or presentation › Talk at conference or symposium › Science to science

Cite this

Langbauer, T. R., Mentin, C., Rindler, M., Vollmaier, F., Connaughton, A., & Krischan, K. (2019). Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.. 1-6. Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy. https://ieeexplore.ieee.org/document/8923595

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions. / Langbauer, Thomas Rainer; Mentin, Christian; Rindler, Michael et al.
2019. 1-6 Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy.

Research output: Contribution to conference › Paper › peer-review

Langbauer, TR, Mentin, C, Rindler, M, Vollmaier, F , Connaughton, A & Krischan, K 2019, 'Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.', Paper presented at International Workshop Thermal Investigation of ICs and Systems, Lecco, Italy, 25/09/19 - 27/09/19 pp. 1-6. <https://ieeexplore.ieee.org/document/8923595>

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title = "Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.",

author = "Langbauer, {Thomas Rainer} and Christian Mentin and Michael Rindler and Franz Vollmaier and Alexander Connaughton and Klaus Krischan",

year = "2019",

month = sep,

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language = "English",

pages = "1--6",

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T1 - Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

AU - Langbauer, Thomas Rainer

AU - Mentin, Christian

AU - Rindler, Michael

AU - Vollmaier, Franz

AU - Connaughton, Alexander

AU - Krischan, Klaus

N1 - Conference code: 25

PY - 2019/9/27

Y1 - 2019/9/27

M3 - Paper

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T2 - International Workshop Thermal Investigation of ICs and Systems

Y2 - 25 September 2019 through 27 September 2019

ER -

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.

Conference

Access to Document

Activities

Gekoppelte elektro-thermische Simulation: Methodik zur Entwicklung eines bidirektionalen Onboard Chargers mit hoher Leistungsdichte

Cite this