Characterization of the immunity of integrated circuits (ICs) at wafer level

Andrea Lavarda; Dominik Amschl; Susanne Bauer; Bernd Deutschmann

doi:10.1109/EMCCompo.2015.7358356

Characterization of the immunity of integrated circuits (ICs) at wafer level

Andrea Lavarda, Dominik Amschl, Susanne Bauer, Bernd Deutschmann

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

This paper deals with the characterization of the immunity of integrated circuits (ICs) by means of their susceptibility to conducted radio frequency (RF) electromagnetic interferences (EMI). It describes and analyses a framework to perform such characterization at wafer level, highlighting the benefits that are reaped from it and the problems that can be faced during the test bench setup and the measurement procedure, providing some possible solutions.

Originalsprache	deutsch
Titel	2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Herausgeber (Verlag)	IEEE Publications
Seiten	196-201
Seitenumfang	6
ISBN (Print)	978-1-4673-7896-3
DOIs	https://doi.org/10.1109/EMCCompo.2015.7358356
Publikationsstatus	Veröffentlicht - 13 Nov. 2015
Veranstaltung	2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Edinburgh, UK Dauer: 10 Nov. 2015 → 13 Nov. 2015

Konferenz

Konferenz	2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Zeitraum	10/11/15 → 13/11/15

Schlagwörter

Radio frequency
Integrated circuits
Probes
Immunity testing
Ports (Computers)

Zugriff auf Dokument

10.1109/EMCCompo.2015.7358356

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7358356

Andere Dateien und Links

https://ieeexplore.ieee.org/document/7358356/

Dieses zitieren

Characterization of the immunity of integrated circuits (ICs) at wafer level. / Lavarda, Andrea; Amschl, Dominik; Bauer, Susanne et al.
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo). IEEE Publications, 2015. S. 196-201 7358356.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Lavarda, A, Amschl, D, Bauer, S & Deutschmann, B 2015, Characterization of the immunity of integrated circuits (ICs) at wafer level. in 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)., 7358356, IEEE Publications, S. 196-201, 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 10/11/15. https://doi.org/10.1109/EMCCompo.2015.7358356

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