A temperature analysis for NFC-powered smart lab-on-chip devices

Carolin Kollegger, Christoph Steffan, Philipp Greiner, Clemens Rabl, David Lugitsch, Gerald Holweg, Bernd Deutschmann

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in einem KonferenzbandBegutachtung

Abstract

This paper presents a temperature analysis for NFC-powered Lab-on-Chip (LoC) solutions. It is based on a monolithically implemented LoC and uses a 130 nm standard CMOS process. The LoC has an active chip area of 6.24 mm 2 . An application-independent temperature gathering mesh is implemented on the chip substrate. It allows a real time NFC-caused temperature analysis. Measurement data regarding heat spreading, the influence of the glob top, and the effect of the PCB layout is presented. A warming reduction from 23.05°C to 3.8°C using the same power source is achieved. Detailed data on the temperature gradient over time for warming and cooling is also provided.

Originalspracheenglisch
Titel2018 IEEE 61st International Midwest Symposium on Circuits and Systems, MWSCAS 2018
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten1058-1061
Seitenumfang4
Band2018-August
ISBN (elektronisch)9781538673928
DOIs
PublikationsstatusVeröffentlicht - 22 Jan 2019
Veranstaltung61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018 - Windsor, Kanada
Dauer: 5 Aug 20188 Aug 2018

Konferenz

Konferenz61st IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2018
Land/GebietKanada
OrtWindsor
Zeitraum5/08/188/08/18

ASJC Scopus subject areas

  • Elektronische, optische und magnetische Materialien
  • Elektrotechnik und Elektronik

Fingerprint

Untersuchen Sie die Forschungsthemen von „A temperature analysis for NFC-powered smart lab-on-chip devices“. Zusammen bilden sie einen einzigartigen Fingerprint.

Dieses zitieren