Abstract
Moisture sorption of microelectronics packages may lead to plasticization of materials such as epoxide-based transfer-molding compounds. This does not only result in a reduction of the modulus but also to a change in the frequency response of the materials. In this work, moisture-induced plasticization effects of unfilled transparent molding compounds are modeled using finite-element reliability simulations of an optical sensor package. Storage modulus data from humidity-controlled dynamic mechanical analysis is used to extend the temperature-dependent linear viscoelastic constitutive model, usually applied using a Prony series and time - temperature superposition, to apply a previously presented time - temperature - moisture concentration superposition of viscoelastic relaxation time-constants. Eventually, stress fields at the die-to-mold compound interface resulting from thermal and hygroscopic strains are compared, applying different complexity of the constitutive model of the compound.
Originalsprache | englisch |
---|---|
Titel | IEEE 71st Electronic Components and Technology Conference, ECTC 2021 |
Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
Seiten | 989-994 |
Seitenumfang | 6 |
ISBN (elektronisch) | 9780738145235 |
DOIs | |
Publikationsstatus | Veröffentlicht - 2021 |
Veranstaltung | 71st IEEE Electronic Components and Technology Conference: ECTC 2021 - Virtual, Online, USA / Vereinigte Staaten Dauer: 1 Juni 2021 → 4 Juli 2021 |
Konferenz
Konferenz | 71st IEEE Electronic Components and Technology Conference |
---|---|
Land/Gebiet | USA / Vereinigte Staaten |
Ort | Virtual, Online |
Zeitraum | 1/06/21 → 4/07/21 |
ASJC Scopus subject areas
- Elektronische, optische und magnetische Materialien
- Elektrotechnik und Elektronik