Wire-Bonding on Porous Copper Layers obtained from Printed Pastes

Markus Heinrici

Research output: Contribution to conferencePosterResearch

Original languageEnglish
Publication statusPublished - 2015
EventInfineon Innovation Week 2014 University Event - München
Duration: 12 Nov 2015 → …

Conference

ConferenceInfineon Innovation Week 2014 University Event
CityMünchen
Period12/11/15 → …

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Heinrici, M. (2015). Wire-Bonding on Porous Copper Layers obtained from Printed Pastes. Poster session presented at Infineon Innovation Week 2014 University Event, München, .

Wire-Bonding on Porous Copper Layers obtained from Printed Pastes. / Heinrici, Markus.

2015. Poster session presented at Infineon Innovation Week 2014 University Event, München, .

Research output: Contribution to conferencePosterResearch

Heinrici, M 2015, 'Wire-Bonding on Porous Copper Layers obtained from Printed Pastes' Infineon Innovation Week 2014 University Event, München, 12/11/15, .
Heinrici M. Wire-Bonding on Porous Copper Layers obtained from Printed Pastes. 2015. Poster session presented at Infineon Innovation Week 2014 University Event, München, .
Heinrici, Markus. / Wire-Bonding on Porous Copper Layers obtained from Printed Pastes. Poster session presented at Infineon Innovation Week 2014 University Event, München, .
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author = "Markus Heinrici",
year = "2015",
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note = "Infineon Innovation Week 2014 University Event ; Conference date: 12-11-2015",

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TY - CONF

T1 - Wire-Bonding on Porous Copper Layers obtained from Printed Pastes

AU - Heinrici, Markus

PY - 2015

Y1 - 2015

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