Wire-Bonding on Porous Copper Layers obtained from Printed Pastes

Markus Heinrici

Research output: Contribution to conferencePosterResearch

Original languageEnglish
Publication statusPublished - 2015
EventInfineon Innovation Week 2014 University Event - München
Duration: 12 Nov 2015 → …

Conference

ConferenceInfineon Innovation Week 2014 University Event
CityMünchen
Period12/11/15 → …

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Heinrici, M. (2015). Wire-Bonding on Porous Copper Layers obtained from Printed Pastes. Poster session presented at Infineon Innovation Week 2014 University Event, München, .