Volcano effect in open through silicon via (TSV) technology

J. Kraft, E. Stückler, C. Cassidy, W. Niko, F. Schrank, E. Wachmann, Christian Gspan, Ferdinand Hofer

Research output: Chapter in Book/Report/Conference proceedingConference paper

Original languageEnglish
Title of host publication2012 IEEE International Reliability Physics Symposium
Place of PublicationPiscataway, NY
PublisherInstitute of Electrical and Electronics Engineers
PagesPI2.1-PI2.5
ISBN (Print)978-1-4577-1678-2
DOIs
Publication statusPublished - 2012
EventIEEE International Reliability Physics Symposium - Anaheim, United States
Duration: 15 Apr 201219 Apr 2012

Conference

ConferenceIEEE International Reliability Physics Symposium
CountryUnited States
CityAnaheim
Period15/04/1219/04/12

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

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