Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor

Jaka Pribosek, Markus Zauner, Jochen Bardong, Alfred Binder, Paul Maierhofer, Alexander Bergmann, Georg Rohrer

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Abstract

In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polyethylene foils. The imprinting is assisted with vacuum release of the polymer foil to reduce the pull-off adhesive force and prevent sticking, posing less constraints on the required lifting force. We apply this method in assembly of a highly integrated optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size (<200 μm), minimal adhesive thicknesses (<15μm), precise out-of plane tolerances, low adhesive squeeze-out and hermetically sealed packaging. A successful selective adhesive bonding with ratio of vacuum tool area to adhesive contact area of 1:20 was demonstrated.

Original languageEnglish
Title of host publication2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9781728116341
DOIs
Publication statusPublished - 1 Oct 2019
Event18th IEEE Sensors, SENSORS 2019 - Montreal, Canada
Duration: 27 Oct 201930 Oct 2019

Publication series

NameProceedings of IEEE Sensors
Volume2019-October
ISSN (Print)1930-0395
ISSN (Electronic)2168-9229

Conference

Conference18th IEEE Sensors, SENSORS 2019
CountryCanada
CityMontreal
Period27/10/1930/10/19

Fingerprint

MOEMS
Adhesives
Vacuum
Sensors
Metal foil
Radiation counters
Polyethylenes
Packaging
Polymers

Keywords

  • heterogeneous integration
  • MEMS
  • MOEMS
  • optical particle counter
  • PM2.5
  • selective adhesive bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Pribosek, J., Zauner, M., Bardong, J., Binder, A., Maierhofer, P., Bergmann, A., & Rohrer, G. (2019). Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor. In 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings [8956807] (Proceedings of IEEE Sensors; Vol. 2019-October). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/SENSORS43011.2019.8956807

Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices : Automated assembly of miniaturized PM sensor. / Pribosek, Jaka; Zauner, Markus; Bardong, Jochen; Binder, Alfred; Maierhofer, Paul; Bergmann, Alexander; Rohrer, Georg.

2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings. Institute of Electrical and Electronics Engineers, 2019. 8956807 (Proceedings of IEEE Sensors; Vol. 2019-October).

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Pribosek, J, Zauner, M, Bardong, J, Binder, A, Maierhofer, P, Bergmann, A & Rohrer, G 2019, Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor. in 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings., 8956807, Proceedings of IEEE Sensors, vol. 2019-October, Institute of Electrical and Electronics Engineers, 18th IEEE Sensors, SENSORS 2019, Montreal, Canada, 27/10/19. https://doi.org/10.1109/SENSORS43011.2019.8956807
Pribosek J, Zauner M, Bardong J, Binder A, Maierhofer P, Bergmann A et al. Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor. In 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings. Institute of Electrical and Electronics Engineers. 2019. 8956807. (Proceedings of IEEE Sensors). https://doi.org/10.1109/SENSORS43011.2019.8956807
Pribosek, Jaka ; Zauner, Markus ; Bardong, Jochen ; Binder, Alfred ; Maierhofer, Paul ; Bergmann, Alexander ; Rohrer, Georg. / Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices : Automated assembly of miniaturized PM sensor. 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings. Institute of Electrical and Electronics Engineers, 2019. (Proceedings of IEEE Sensors).
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