The evaluation method for ESD immunity of components in terms of soft error

Jaedeok Lim*, Jongsung Lee, Byongsu Seol, Argha Nandy, David Pommerenke

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming more refined, high speed and multifunction, that failure trend is getting more general. The importance of cooperation between set developer and component developer has been emphasized in ESD field. Especially, making a correlation in measurement and analytical method is very important. Through this paper, the evaluation method for ESD immunity of components will be suggested for designing ESD robust product.

Original languageEnglish
Title of host publicationProceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility
Pages468-471
Number of pages4
Publication statusPublished - 14 Dec 2011
Externally publishedYes
Event10th International Symposium on Electromagnetic Compatibility, EMC Europe 2011 - York, United Kingdom
Duration: 26 Sep 201130 Sep 2011

Publication series

NameProceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility

Conference

Conference10th International Symposium on Electromagnetic Compatibility, EMC Europe 2011
CountryUnited Kingdom
CityYork
Period26/09/1130/09/11

Keywords

  • Component-level
  • ESD
  • Soft-error

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Lim, J., Lee, J., Seol, B., Nandy, A., & Pommerenke, D. (2011). The evaluation method for ESD immunity of components in terms of soft error. In Proceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility (pp. 468-471). [6078617] (Proceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility).