| Original language | English |
|---|---|
| Title of host publication | VLSI in the nanometer era |
| Place of Publication | New York, NY |
| Publisher | Association of Computing Machinery |
| Pages | 76-79 |
| ISBN (Print) | 1-58113-677-3 |
| DOIs | |
| Publication status | Published - 2003 |
| Event | ACM Great Lakes Symposium on VLSI - Washington, D.C., United States Duration: 28 Apr 2003 → 29 Apr 2003 |
Conference
| Conference | ACM Great Lakes Symposium on VLSI |
|---|---|
| Country | United States |
| City | Washington, D.C. |
| Period | 28/04/03 → 29/04/03 |
Fields of Expertise
- Sonstiges
Cite this
Ostermann, T., & Deutschmann, B. (2003). TEM-Cell and Surface Scan to Identify the Electromagnetic Emission of Integrated Circuits. In VLSI in the nanometer era (pp. 76-79). New York, NY: Association of Computing Machinery. https://doi.org/10.1145/764808.764829
TEM-Cell and Surface Scan to Identify the Electromagnetic Emission of Integrated Circuits. / Ostermann, Timm; Deutschmann, Bernd.
VLSI in the nanometer era. New York, NY : Association of Computing Machinery, 2003. p. 76-79.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Research › peer-review
Ostermann, T & Deutschmann, B 2003, TEM-Cell and Surface Scan to Identify the Electromagnetic Emission of Integrated Circuits. in VLSI in the nanometer era. Association of Computing Machinery, New York, NY, pp. 76-79, ACM Great Lakes Symposium on VLSI, Washington, D.C., United States, 28/04/03. https://doi.org/10.1145/764808.764829
Ostermann T, Deutschmann B. TEM-Cell and Surface Scan to Identify the Electromagnetic Emission of Integrated Circuits. In VLSI in the nanometer era. New York, NY: Association of Computing Machinery. 2003. p. 76-79 https://doi.org/10.1145/764808.764829
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