Synchronization of time-of-flight 3D sensors for optical communication

Hannes Plank, Armin Schoenlieb, Christoph Ehrenhoefer, Christian Steger, Gerald Holweg, Norbert Druml

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Abstract

Time-of-Flight 3D imaging systems are promising transceivers for image sensor based optical communication. 3D sensing based on Time-of-Flight is the most miniaturized depth imaging technology available and is currently being integrated into consumer electronics such as smart phones. Optical line-of-sight communication with a depth imaging system offers complete location-awareness of the communication partner. This enables new opportunities in fields like secure authentication, augmented reality or vehicle to vehicle communication. We show how Time-of-Flight systems are capable of using phase shift keying of pulsed light (PLPSK) to transmit data over a line-of-sight connection. PLPSK is still unexplored in the domain of image sensors and enables Time-of-Flight sensors to transmit multiple bits per frame at rates of over 7 kHz. A serious problem however are asynchronous modulation signals, causing frequent transmission errors and impairing proper communication. In this work, we formulate and discuss the severity of the problem and propose a synchronization procedure. We evaluate our solution with a prototype system, and show that it is possible to reach a synchronization success rate of nearly 100% over a distance of 9 meter.

LanguageEnglish
Title of host publication2017 IEEE International Conference on Communications, ICC 2017
PublisherInstitute of Electrical and Electronics Engineers
Number of pages6
ISBN (Electronic)9781467389990
DOIs
StatusPublished - 28 Jul 2017
Event2017 IEEE International Conference on Communications, ICC 2017 - Paris, France
Duration: 21 May 201725 May 2017

Conference

Conference2017 IEEE International Conference on Communications, ICC 2017
CountryFrance
CityParis
Period21/05/1725/05/17

Fingerprint

Optical communication
Synchronization
Image sensors
Imaging systems
Communication
Sensors
Vehicle to vehicle communications
Consumer electronics
Augmented reality
Phase shift keying
Transceivers
Authentication
Modulation
Imaging techniques

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Plank, H., Schoenlieb, A., Ehrenhoefer, C., Steger, C., Holweg, G., & Druml, N. (2017). Synchronization of time-of-flight 3D sensors for optical communication. In 2017 IEEE International Conference on Communications, ICC 2017 [7996373] Institute of Electrical and Electronics Engineers. DOI: 10.1109/ICC.2017.7996373

Synchronization of time-of-flight 3D sensors for optical communication. / Plank, Hannes; Schoenlieb, Armin; Ehrenhoefer, Christoph; Steger, Christian; Holweg, Gerald; Druml, Norbert.

2017 IEEE International Conference on Communications, ICC 2017. Institute of Electrical and Electronics Engineers, 2017. 7996373.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Plank, H, Schoenlieb, A, Ehrenhoefer, C, Steger, C, Holweg, G & Druml, N 2017, Synchronization of time-of-flight 3D sensors for optical communication. in 2017 IEEE International Conference on Communications, ICC 2017., 7996373, Institute of Electrical and Electronics Engineers, 2017 IEEE International Conference on Communications, ICC 2017, Paris, France, 21/05/17. DOI: 10.1109/ICC.2017.7996373
Plank H, Schoenlieb A, Ehrenhoefer C, Steger C, Holweg G, Druml N. Synchronization of time-of-flight 3D sensors for optical communication. In 2017 IEEE International Conference on Communications, ICC 2017. Institute of Electrical and Electronics Engineers. 2017. 7996373. Available from, DOI: 10.1109/ICC.2017.7996373
Plank, Hannes ; Schoenlieb, Armin ; Ehrenhoefer, Christoph ; Steger, Christian ; Holweg, Gerald ; Druml, Norbert. / Synchronization of time-of-flight 3D sensors for optical communication. 2017 IEEE International Conference on Communications, ICC 2017. Institute of Electrical and Electronics Engineers, 2017.
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