SPICE Modeling of Process Variation Using Location Depth Corner Models

Gerhard Rappitsch, Ehrenfried Seebacher, Michael Kocher, Ernst Stadlober

Research output: Contribution to journalArticleResearchpeer-review

Original languageEnglish
Pages (from-to)201-213
JournalIEEE transactions on semiconductor manufacturing
Volume17
Issue number2
DOIs
Publication statusPublished - 2004

Cite this

SPICE Modeling of Process Variation Using Location Depth Corner Models. / Rappitsch, Gerhard; Seebacher, Ehrenfried; Kocher, Michael; Stadlober, Ernst.

In: IEEE transactions on semiconductor manufacturing, Vol. 17, No. 2, 2004, p. 201-213.

Research output: Contribution to journalArticleResearchpeer-review

Rappitsch, Gerhard ; Seebacher, Ehrenfried ; Kocher, Michael ; Stadlober, Ernst. / SPICE Modeling of Process Variation Using Location Depth Corner Models. In: IEEE transactions on semiconductor manufacturing. 2004 ; Vol. 17, No. 2. pp. 201-213.
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