SPICE Modeling of Process Variation Using Location Depth Corner Models

Gerhard Rappitsch, Ehrenfried Seebacher, Michael Kocher, Ernst Stadlober

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)201-213
JournalIEEE transactions on semiconductor manufacturing
Volume17
Issue number2
DOIs
Publication statusPublished - 2004

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