Soft-Failures in Component-Level ESD Testing on the Example of a Bandgap

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electrostatic Discharge immunity is a design challenge for electronic components and systems alike. Unfortunately, component-level Electrostatic Discharge data seldom provides useful information for system design. In order to pick a suitable component to meet the system's Electrostatic Discharge requirements, a more sophisticated characterisation of components with respect to Electrostatic Discharge has to be found. In particular, soft-failures in component-level Electrostatic Discharge testing are required. This paper presents a new soft-failure Electrostatic Discharge characterisation to help system designers.
Original languageEnglish
Title of host publication2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
PublisherIEEE Xplore
Number of pages3
DOIs
Publication statusPublished - 21 Oct 2019
EventThe 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits - Zhejiang University, Haining, China
Duration: 21 Oct 201923 Oct 2019
http://www.emcconf.org/

Conference

ConferenceThe 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Abbreviated titleEMC Compo
CountryChina
CityHaining
Period21/10/1923/10/19
Internet address

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  • Activities

    • 1 Conference or symposium (Participation in/Organisation of)
    • 1 Talk at conference or symposium

    Soft-Failures in Component-Level ESD Testing on the Example of a Bandgap

    Patrick Schrey (Speaker)
    22 Oct 2019

    Activity: Talk or presentationTalk at conference or symposiumScience to science

    The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

    Patrick Schrey (Participant)
    21 Oct 201923 Oct 2019

    Activity: Participation in or organisation ofConference or symposium (Participation in/Organisation of)

    Cite this

    Schrey, P. (2019). Soft-Failures in Component-Level ESD Testing on the Example of a Bandgap. In 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) IEEE Xplore. https://doi.org/10.1109/EMCCompo.2019.8919921