Simple D flip-flop behavioral model of ESD immunity for use in the ISO 10605 standard

Guangyao Shen; Victor Khilkevich; Sen Yang; David Pommerenke; Hermann Aichele; Dirk Eichel; Christoph Keller

doi:10.1109/ISEMC.2014.6899015

Simple D flip-flop behavioral model of ESD immunity for use in the ISO 10605 standard

Guangyao Shen, Victor Khilkevich, Sen Yang, David Pommerenke, Hermann Aichele, Dirk Eichel, Christoph Keller

Research output: Contribution to journal › Conference article

Abstract

As the ESD stress is becoming more and more important for integrated circuits (ICs), the ability to predict IC failures becomes critical. In this paper, an 18 MHz D flip-flop IC is characterized and its behavioral model is presented. The resulting IC model is validated in the setup according to the ISO 10605 standard. A complete model of the setup combining the IC behavioral model and the passive parts of the setup is built to estimate the failure prediction accuracy in a totally simulated environment. The results show that the model can predict the triggering level with the error of less than 20%.

Original language	English
Article number	6899015
Pages (from-to)	455-459
Number of pages	5
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	2014-September
Issue number	September
DOIs	https://doi.org/10.1109/ISEMC.2014.6899015
Publication status	Published - 15 Sep 2014
Externally published	Yes
Event	2014 IEEE International Symposium on Electromagnetic Compatibility: EMC 2014 - Raleigh, United States Duration: 3 Aug 2014 → 8 Aug 2014

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ISEMC.2014.6899015

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Simple D flip-flop behavioral model of ESD immunity for use in the ISO 10605 standard. / Shen, Guangyao; Khilkevich, Victor; Yang, Sen; Pommerenke, David; Aichele, Hermann; Eichel, Dirk; Keller, Christoph.

In: IEEE International Symposium on Electromagnetic Compatibility, Vol. 2014-September, No. September, 6899015, 15.09.2014, p. 455-459.

Research output: Contribution to journal › Conference article

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