SEED Modeling of an ESD Gun Discharge to a USB Cable Surrogate

Yang Xu, Jianchi Zhou, Javad Meiguni, Daryl G. Beetner, Sergej Bub, Steffen Holland, David Pommerenke

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review

Abstract

An IC protected by a transient voltage suppression (TVS) diode may fail if the TVS device does not turn on or does not turn on quickly enough, causing the IC to take the full brunt of the ESD event. System Efficient ESD Design (SEED) simulation can help predict when the TVS will turn on and the level of ESD stress seen by the IC. In the following paper, models are developed to predict the voltage and current through a TVS and on-chip protection diodes connected to a USB cable when an ESD gun discharges to a pin at the end of the cable. A hybrid simulation methodology is proposed, which uses a full-wave model of the ESD gun, cable, and enclosure combined with the ESD protection devices and test board's circuit-level models. The response of the ESD protection is studied in simulation and measurement for a variety of cable configurations. Simulations of the voltage and current waveforms match measurements 24-35%. The total charge delivered to the on-chip diode as a function of ESD gun voltage was predicted within 21%.
Original languageEnglish
Title of host publication2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021
PublisherIEEE Publications
Pages1159-1164
Number of pages6
ISBN (Electronic)9781665448888
ISBN (Print)978-1-6654-4889-5
DOIs
Publication statusPublished - 26 Jul 2021
Event2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe: EMC/SI/PI/EMC Europe 2021 - Raleigh, United States
Duration: 26 Jul 202120 Aug 2021

Publication series

Name2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021

Conference

Conference2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe
Abbreviated titleEMC/SI/PI/EMC Europe 2021
Country/TerritoryUnited States
CityRaleigh
Period26/07/2120/08/21

Keywords

  • cable discharge
  • electromagnetic compatibility (EMC)
  • Electrostatic discharge (ESD)
  • system-efficient ESD design (SEED)
  • USB

ASJC Scopus subject areas

  • Aerospace Engineering
  • Safety, Risk, Reliability and Quality
  • Signal Processing
  • Energy Engineering and Power Technology
  • Radiation
  • Electrical and Electronic Engineering

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