Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates

Harald Etschmaier*, Jiri Novak, Hannes Eder, Peter Hadley

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemistry