Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates

Harald Etschmaier, Jiri Novak, Hannes Eder, Peter Hadley

Research output: Contribution to journalArticleResearchpeer-review

Abstract

The dynamics and the morphology of the intermetallic phase evolution for isothermal diffusion soldering with the eutectic Au-Sn alloy as the solder material on copper and silver substrates was investigated. The phases involved and the reaction parameters like the rate of the intermetallic layer growth and the activation energy could be determined by in-situ X-ray diffraction. Transmission electron microscopy and energy dispersive X-ray spectroscopy bring further insight into the morphology changes that occur during the process. The results contribute to a better understanding of this advanced joining method extensively used in semiconductor packaging.

Original languageEnglish
Pages (from-to)87-92
Number of pages6
JournalIntermetallics
Volume20
Issue number1
DOIs
Publication statusPublished - Jan 2012

Fingerprint

Soldering
Silver
Eutectics
Intermetallics
Copper
Substrates
Joining
Soldering alloys
Packaging
Activation energy
Semiconductor materials
Transmission electron microscopy
X ray diffraction
X-Ray Emission Spectrometry

Keywords

  • A. Nanostructured intermetallics
  • B. Phase identification
  • B. Phase transformation
  • C. Joining
  • C. Thin films

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Chemistry
  • Metals and Alloys
  • Chemistry(all)

Cite this

Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates. / Etschmaier, Harald; Novak, Jiri; Eder, Hannes; Hadley, Peter.

In: Intermetallics, Vol. 20, No. 1, 01.2012, p. 87-92.

Research output: Contribution to journalArticleResearchpeer-review

Etschmaier, Harald ; Novak, Jiri ; Eder, Hannes ; Hadley, Peter. / Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates. In: Intermetallics. 2012 ; Vol. 20, No. 1. pp. 87-92.
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