Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates

Harald Etschmaier*, Jiri Novak, Hannes Eder, Peter Hadley

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

The dynamics and the morphology of the intermetallic phase evolution for isothermal diffusion soldering with the eutectic Au-Sn alloy as the solder material on copper and silver substrates was investigated. The phases involved and the reaction parameters like the rate of the intermetallic layer growth and the activation energy could be determined by in-situ X-ray diffraction. Transmission electron microscopy and energy dispersive X-ray spectroscopy bring further insight into the morphology changes that occur during the process. The results contribute to a better understanding of this advanced joining method extensively used in semiconductor packaging.

Original languageEnglish
Pages (from-to)87-92
Number of pages6
JournalIntermetallics
Volume20
Issue number1
DOIs
Publication statusPublished - Jan 2012

Keywords

  • A. Nanostructured intermetallics
  • B. Phase identification
  • B. Phase transformation
  • C. Joining
  • C. Thin films

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Chemistry
  • Metals and Alloys
  • Chemistry(all)

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