Proceedings on Low-Stress Printed Copper for Thick Power Metallizations

Markus Heinrici, Martin Mischitz, Barbara Eichinger, Caterina Travan

Research output: Contribution to conferencePosterResearch

Original languageEnglish
Publication statusPublished - 2014
EventInfineon Innovation Week 2014 University Event - München
Duration: 6 Nov 20147 Nov 2014

Conference

ConferenceInfineon Innovation Week 2014 University Event
CityMünchen
Period6/11/147/11/14

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Heinrici, M., Mischitz, M., Eichinger, B., & Travan, C. (2014). Proceedings on Low-Stress Printed Copper for Thick Power Metallizations. Poster session presented at Infineon Innovation Week 2014 University Event, München, .