Printed Copper for Power Devices - Implementation as Backside Metallization

Markus Heinrici, Martin Mischitz

Research output: Contribution to conferencePosterResearch

Original languageEnglish
Publication statusPublished - 2015
EventIFAT 16th Innovation Days - Villach
Duration: 6 May 20156 May 2015

Conference

ConferenceIFAT 16th Innovation Days
CityVillach
Period6/05/156/05/15

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Heinrici, M., & Mischitz, M. (2015). Printed Copper for Power Devices - Implementation as Backside Metallization. Poster session presented at IFAT 16th Innovation Days, Villach, .

Printed Copper for Power Devices - Implementation as Backside Metallization. / Heinrici, Markus; Mischitz, Martin.

2015. Poster session presented at IFAT 16th Innovation Days, Villach, .

Research output: Contribution to conferencePosterResearch

Heinrici, M & Mischitz, M 2015, 'Printed Copper for Power Devices - Implementation as Backside Metallization' IFAT 16th Innovation Days, Villach, 6/05/15 - 6/05/15, .
Heinrici M, Mischitz M. Printed Copper for Power Devices - Implementation as Backside Metallization. 2015. Poster session presented at IFAT 16th Innovation Days, Villach, .
Heinrici, Markus ; Mischitz, Martin. / Printed Copper for Power Devices - Implementation as Backside Metallization. Poster session presented at IFAT 16th Innovation Days, Villach, .
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language = "English",
note = "IFAT 16th Innovation Days ; Conference date: 06-05-2015 Through 06-05-2015",

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TY - CONF

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