Physically based microstructure modelling of AA6082 during hot extrusion

Friedrich Krumphals, Pavel Sherstnev, Stefan Mitsche, Sasa Randjelovic, Christof Sommitsch

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationProceeding International Conference on Extrusion and Benchmark
Publisher.
Pages---
Publication statusPublished - 2009
EventInternational Conference on Extrusion and Benchmark - Dortmund, Germany
Duration: 16 Sep 200917 Sep 2009

Conference

ConferenceInternational Conference on Extrusion and Benchmark
CountryGermany
CityDortmund
Period16/09/0917/09/09

Cite this

Krumphals, F., Sherstnev, P., Mitsche, S., Randjelovic, S., & Sommitsch, C. (2009). Physically based microstructure modelling of AA6082 during hot extrusion. In Proceeding International Conference on Extrusion and Benchmark (pp. ---). ..

Physically based microstructure modelling of AA6082 during hot extrusion. / Krumphals, Friedrich; Sherstnev, Pavel; Mitsche, Stefan; Randjelovic, Sasa; Sommitsch, Christof.

Proceeding International Conference on Extrusion and Benchmark. ., 2009. p. ---.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Krumphals, F, Sherstnev, P, Mitsche, S, Randjelovic, S & Sommitsch, C 2009, Physically based microstructure modelling of AA6082 during hot extrusion. in Proceeding International Conference on Extrusion and Benchmark. ., pp. ---, International Conference on Extrusion and Benchmark, Dortmund, Germany, 16/09/09.
Krumphals F, Sherstnev P, Mitsche S, Randjelovic S, Sommitsch C. Physically based microstructure modelling of AA6082 during hot extrusion. In Proceeding International Conference on Extrusion and Benchmark. . 2009. p. ---
Krumphals, Friedrich ; Sherstnev, Pavel ; Mitsche, Stefan ; Randjelovic, Sasa ; Sommitsch, Christof. / Physically based microstructure modelling of AA6082 during hot extrusion. Proceeding International Conference on Extrusion and Benchmark. ., 2009. pp. ---
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