PCB ground fill design guidelines for radiated EMI

Weifeng Pan; David Pommerenke; Shuai Xu; Jun Jia

doi:10.1109/ISEMC.2008.4652141

PCB ground fill design guidelines for radiated EMI

Weifeng Pan, David Pommerenke, Shuai Xu, Jun Jia

Research output: Contribution to journal › Conference article › peer-review

Abstract

This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

Original language	English
Article number	4652141
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	2008-January
DOIs	https://doi.org/10.1109/ISEMC.2008.4652141
Publication status	Published - 1 Jan 2008
Externally published	Yes
Event	2008 IEEE International Symposium on Electromagnetic Compatibility: EMC 2008 - Detroit, United States Duration: 18 Aug 2008 → 22 Aug 2008

Keywords

design guideline
EMI
Ground fill
PCB

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ISEMC.2008.4652141

Cite this

@article{6cdd2f2e0b07404ebd642fd74e2f5cda,

title = "PCB ground fill design guidelines for radiated EMI",

abstract = "This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.",

keywords = "design guideline, EMI, Ground fill, PCB",

author = "Weifeng Pan and David Pommerenke and Shuai Xu and Jun Jia",

year = "2008",

month = jan,

day = "1",

doi = "10.1109/ISEMC.2008.4652141",

language = "English",

volume = "2008-January",

journal = "IEEE International Symposium on Electromagnetic Compatibility",

issn = "1077-4076",

publisher = "Institute of Electrical and Electronics Engineers",

note = "2008 IEEE International Symposium on Electromagnetic Compatibility : EMC 2008 ; Conference date: 18-08-2008 Through 22-08-2008",

}

TY - JOUR

T1 - PCB ground fill design guidelines for radiated EMI

AU - Pan, Weifeng

AU - Pommerenke, David

AU - Xu, Shuai

AU - Jia, Jun

PY - 2008/1/1

Y1 - 2008/1/1

N2 - This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

AB - This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

KW - design guideline

KW - EMI

KW - Ground fill

KW - PCB

UR - http://www.scopus.com/inward/record.url?scp=79952385337&partnerID=8YFLogxK

U2 - 10.1109/ISEMC.2008.4652141

DO - 10.1109/ISEMC.2008.4652141

M3 - Conference article

AN - SCOPUS:79952385337

SN - 1077-4076

VL - 2008-January

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

M1 - 4652141

T2 - 2008 IEEE International Symposium on Electromagnetic Compatibility

Y2 - 18 August 2008 through 22 August 2008

ER -

PCB ground fill design guidelines for radiated EMI

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this