PCB ground fill design guidelines for radiated EMI

Weifeng Pan, David Pommerenke, Shuai Xu, Jun Jia

Research output: Contribution to journalConference article

Abstract

This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

Original languageEnglish
Article number4652141
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume2008-January
DOIs
Publication statusPublished - 1 Jan 2008
Externally publishedYes
Event2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 - Detroit, United States
Duration: 18 Aug 200822 Aug 2008

Keywords

  • design guideline
  • EMI
  • Ground fill
  • PCB

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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