New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing

Roland Schmied, Boril Stefanov Chernev, Gregor Trimmel, Harald Plank

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationPhysical Sciences: Tools and Techniques
Publisher.
Pages775-776
ISBN (Print)978-0-9502463-6-9
Publication statusPublished - 2012
EventEuropean Microscopy Congress - Manchester
Duration: 16 Sep 201221 Sep 2012

Conference

ConferenceEuropean Microscopy Congress
CityManchester
Period16/09/1221/09/12

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Schmied, R., Chernev, B. S., Trimmel, G., & Plank, H. (2012). New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. In Physical Sciences: Tools and Techniques (pp. 775-776). ..