New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing

Roland Schmied, Boril Stefanov Chernev, Gregor Trimmel, Harald Plank

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationPhysical Sciences: Tools and Techniques
Publisher.
Pages775-776
ISBN (Print)978-0-9502463-6-9
Publication statusPublished - 2012
EventEuropean Microscopy Congress - Manchester
Duration: 16 Sep 201221 Sep 2012

Conference

ConferenceEuropean Microscopy Congress
CityManchester
Period16/09/1221/09/12

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Schmied, R., Chernev, B. S., Trimmel, G., & Plank, H. (2012). New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. In Physical Sciences: Tools and Techniques (pp. 775-776). ..

New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. / Schmied, Roland; Chernev, Boril Stefanov; Trimmel, Gregor; Plank, Harald.

Physical Sciences: Tools and Techniques. ., 2012. p. 775-776.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Schmied, R, Chernev, BS, Trimmel, G & Plank, H 2012, New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. in Physical Sciences: Tools and Techniques. ., pp. 775-776, European Microscopy Congress, Manchester, 16/09/12.
Schmied, Roland ; Chernev, Boril Stefanov ; Trimmel, Gregor ; Plank, Harald. / New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. Physical Sciences: Tools and Techniques. ., 2012. pp. 775-776
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