New possibilities for soft matter applications: eliminating technically induced thermal stress during FIB processing{

Roland Schmied; Boril Stefanov Chernev; Gregor Trimmel; Harald Plank

doi:10.1039/c2ra21025h

New possibilities for soft matter applications: eliminating technically induced thermal stress during FIB processing{

Roland Schmied, Boril Stefanov Chernev, Gregor Trimmel, Harald Plank

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	6932-6938
Journal	RSC Advances
Issue number	2
DOIs	https://doi.org/10.1039/c2ra21025h
Publication status	Published - 2012

Fields of Expertise

Advanced Materials Science

Treatment code (Nähere Zuordnung)

Basic - Fundamental (Grundlagenforschung)

Access to Document

10.1039/c2ra21025h

Functional Nanofabrication
Dohr, J., Plank, H., Rosker, S., Winkler, R., Stermitz, M., Reisecker, V., Michelitsch, S. G. W., Brugger-Hatzl, M., Schmied, R., Eicher, B., Orthacker, A., Arnold, G., Sattelkow, J., Kolb, F., Ganner, T., Haselmann, U., Seewald, L. & Aschl, T.
1/01/09 → 31/12/23
Project: Research project

Cite this

@article{716ca08b07b24494b928a706a1e15e5d,

title = "New possibilities for soft matter applications: eliminating technically induced thermal stress during FIB processing{",

author = "Roland Schmied and Chernev, {Boril Stefanov} and Gregor Trimmel and Harald Plank",

year = "2012",

doi = "10.1039/c2ra21025h",

language = "English",

pages = "6932--6938",

journal = "RSC Advances ",

issn = "2046-2069",

publisher = "Royal Society of Chemistry",

number = "2",

}

TY - JOUR

T1 - New possibilities for soft matter applications: eliminating technically induced thermal stress during FIB processing{

AU - Schmied, Roland

AU - Chernev, Boril Stefanov

AU - Trimmel, Gregor

AU - Plank, Harald

PY - 2012

Y1 - 2012

U2 - 10.1039/c2ra21025h

DO - 10.1039/c2ra21025h

M3 - Article

SN - 2046-2069

SP - 6932

EP - 6938

JO - RSC Advances

JF - RSC Advances

IS - 2

ER -

New possibilities for soft matter applications: eliminating technically induced thermal stress during FIB processing{

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Projects

Functional Nanofabrication

Cite this