New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing

Roland Schmied, Boril Stefanov Chernev, Gregor Trimmel, Harald Plank

Research output: Contribution to conferencePosterResearch

Original languageEnglish
Publication statusPublished - 2012
EventEuropean Microscopy Congress - Manchester
Duration: 16 Sep 201221 Sep 2012

Conference

ConferenceEuropean Microscopy Congress
CityManchester
Period16/09/1221/09/12

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Schmied, R., Chernev, B. S., Trimmel, G., & Plank, H. (2012). New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. Poster session presented at European Microscopy Congress, Manchester, .

New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. / Schmied, Roland; Chernev, Boril Stefanov; Trimmel, Gregor; Plank, Harald.

2012. Poster session presented at European Microscopy Congress, Manchester, .

Research output: Contribution to conferencePosterResearch

Schmied, R, Chernev, BS, Trimmel, G & Plank, H 2012, 'New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing' European Microscopy Congress, Manchester, 16/09/12 - 21/09/12, .
Schmied R, Chernev BS, Trimmel G, Plank H. New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. 2012. Poster session presented at European Microscopy Congress, Manchester, .
Schmied, Roland ; Chernev, Boril Stefanov ; Trimmel, Gregor ; Plank, Harald. / New possibilities for soft matter applications: Eliminating technically induced thermal stress during FIB processing. Poster session presented at European Microscopy Congress, Manchester, .
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year = "2012",
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PY - 2012

Y1 - 2012

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