Modular Test System Architecture for Device, Circuit, and System Level Reliability Testing and Condition Monitoring

Roland Sleik, Michael Glavanovics, Sascha Einspieler, Annette Mütze, Klaus Krischan

Research output: Contribution to journalArticleResearchpeer-review


Reliability stress testing of power semiconductors requires significant development effort for a test apparatus to provide the required functionality. This paper presents a modular test system (MTS) architecture that focuses on flexibility, reusability, and adaptability to future test requirements. Different types of tests for different devices in application circuit configuration can be implemented based on the same MTS concept. Vital parameters of the device under test can be acquired in situ during the running stress test. This enables the collection of drift data of these parameters. The control and data acquisition parts of the test system are clearly separated from the actual test circuit. With this physical separation, the same control part can be used for different types of
tests. Experimental results of an already implemented test system are provided.
Original languageEnglish
Pages (from-to)5698-5708
Number of pages11
JournalIEEE Transactions on Industry Applications
Issue number6
Publication statusPublished - Nov 2017



  • aging
  • condition monitoring
  • dc–dc power converters
  • drift data
  • In situ measurement
  • life testing
  • power cyclingpower semiconductor devices, semiconductor device reliability, stress conditions, test apparatus, wear-out.
  • power semiconductor devices
  • semiconductor device reliability
  • stress conditions
  • test apparatus
  • wear-out

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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