Model-Based Temperature Control in Thermal Processing of Silicon Wafers

Stefan Koch; Alexander Schaum; Martin Kleindienst; Markus Reichhartinger; Thomas  Meurer; Jaime A. Moreno; Martin Horn

doi:10.1016/j.ifacol.2022.10.397

Model-Based Temperature Control in Thermal Processing of Silicon Wafers

Stefan Koch, Alexander Schaum, Martin Kleindienst, Markus Reichhartinger, Thomas Meurer, Jaime A. Moreno, Martin Horn

Institute of Automation and Control (4430)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

The paper proposes a model-based control approach for thermal processing of silicon wafers such as rapid thermal processing. Heating of the wafer is achieved with a large number of high-power LEDs which enable targeted heating over the entire spatial domain. Taking advantage of this feature, a distributed PI controller is first designed assuming an idealized distributed input. This control signal is then approximated by the actual control that enters the system through shape functions using an optimization procedure. A formal analysis of the input-to-state stability with respect to the actuator error, extension with an anti-windup scheme and an experimental validation of the proposed approach are presented.

Original language	English
Title of host publication	4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations CPDE 2022
Pages	180-186
Number of pages	7
Volume	55
Edition	26
DOIs	https://doi.org/10.1016/j.ifacol.2022.10.397
Publication status	Published - 2022
Event	4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations - Kiel, Germany Duration: 5 Sep 2022 → 7 Sep 2022 http://cpde2022.org/

Publication series

Name	IFAC-PapersOnLine

Conference

Conference	4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations
Abbreviated title	CPDE
Country/Territory	Germany
City	Kiel
Period	5/09/22 → 7/09/22
Internet address	http://cpde2022.org/

Keywords

Anti-windup
Distributed-parameter systems
Input-to-state stability
Manufacturing processes
Model-based control
Temperature control

ASJC Scopus subject areas

Control and Systems Engineering

Access to Document

10.1016/j.ifacol.2022.10.397

Cite this

Koch, S., Schaum, A., Kleindienst, M., Reichhartinger, M., Meurer, T., Moreno, J. A., & Horn, M. (2022). Model-Based Temperature Control in Thermal Processing of Silicon Wafers. In 4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations CPDE 2022 (26 ed., Vol. 55, pp. 180-186). (IFAC-PapersOnLine). https://doi.org/10.1016/j.ifacol.2022.10.397

Model-Based Temperature Control in Thermal Processing of Silicon Wafers. / Koch, Stefan; Schaum, Alexander; Kleindienst, Martin et al.

4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations CPDE 2022. Vol. 55 26. ed. 2022. p. 180-186 (IFAC-PapersOnLine).

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Koch, S, Schaum, A, Kleindienst, M, Reichhartinger, M, Meurer, T, Moreno, JA & Horn, M 2022, Model-Based Temperature Control in Thermal Processing of Silicon Wafers. in 4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations CPDE 2022. 26 edn, vol. 55, IFAC-PapersOnLine, pp. 180-186, 4th IFAC Workshop on Control of Systems Governed by Partial Differential Equations, Kiel, Germany, 5/09/22. https://doi.org/10.1016/j.ifacol.2022.10.397

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abstract = "The paper proposes a model-based control approach for thermal processing of silicon wafers such as rapid thermal processing. Heating of the wafer is achieved with a large number of high-power LEDs which enable targeted heating over the entire spatial domain. Taking advantage of this feature, a distributed PI controller is first designed assuming an idealized distributed input. This control signal is then approximated by the actual control that enters the system through shape functions using an optimization procedure. A formal analysis of the input-to-state stability with respect to the actuator error, extension with an anti-windup scheme and an experimental validation of the proposed approach are presented.",

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Model-Based Temperature Control in Thermal Processing of Silicon Wafers

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Keywords

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