Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process

Markus Heinrici (Inventor), Martin Mischitz (Inventor), Manfred Schneegans (Inventor)

Research output: PatentResearch

Original languageGerman
Patent numberUS 20150214095 A1
Publication statusPublished - 30 Jul 2015

Fields of Expertise

  • Advanced Materials Science

Cite this

Heinrici, M., Mischitz, M., & Schneegans, M. (2015). Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process. (Patent No. US 20150214095 A1).

Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process. / Heinrici, Markus (Inventor); Mischitz, Martin (Inventor); Schneegans, Manfred (Inventor).

Patent No.: US 20150214095 A1.

Research output: PatentResearch

Heinrici, M, Mischitz, M & Schneegans, M 2015, Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process, Patent No. US 20150214095 A1.
Heinrici M, Mischitz M, Schneegans M, inventors. Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process. US 20150214095 A1. 2015 Jul 30.
Heinrici, Markus (Inventor) ; Mischitz, Martin (Inventor) ; Schneegans, Manfred (Inventor). / Method for Producing a Copper Layer on a Semiconductor Body Using a Printing Process. Patent No.: US 20150214095 A1.
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