Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack

Suyu Yang; Benjamin Orr; Yuangdong Guo; Yilong Zhang; David Pommerenke; Hideki Shumiya; Junji Maeshima; Taketoshi Sekine; Yuzo Takita; Kenji Araki

doi:10.1109/ISEMC.2016.7571597

Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack

Suyu Yang, Benjamin Orr, Yuangdong Guo, Yilong Zhang, David Pommerenke, Hideki Shumiya, Junji Maeshima, Taketoshi Sekine, Yuzo Takita, Kenji Araki

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

In this paper, several methods are outlined for detecting functional changes in an IC due to external interference such as ESD or EMI. The goal is to provide diagnostic tools for detection of potential soft failure susceptibilities of complex systems during the hardware design stage without the aid of any complex software.

Original language	English
Title of host publication	2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016
Publisher	Institute of Electrical and Electronics Engineers
Pages	41-45
Number of pages	5
ISBN (Electronic)	9781509014415
DOIs	https://doi.org/10.1109/ISEMC.2016.7571597
Publication status	Published - 19 Sept 2016
Externally published	Yes
Event	2016 IEEE International Symposium on Electromagnetic Compatibility: EMC 2016 - Ottawa, Canada Duration: 25 Jul 2016 → 29 Jul 2016

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
Volume	2016-September
ISSN (Print)	1077-4076
ISSN (Electronic)	2158-1118

Conference

Conference	2016 IEEE International Symposium on Electromagnetic Compatibility
Country/Territory	Canada
City	Ottawa
Period	25/07/16 → 29/07/16

Keywords

EMI
ESD
soft failure
testing

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ISEMC.2016.7571597

Cite this

Yang, S., Orr, B., Guo, Y., Zhang, Y., Pommerenke, D., Shumiya, H., Maeshima, J., Sekine, T., Takita, Y., & Araki, K. (2016). Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack. In 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016 (pp. 41-45). Article 7571597 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2016-September). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISEMC.2016.7571597

Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack. / Yang, Suyu; Orr, Benjamin; Guo, Yuangdong et al.
2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016. Institute of Electrical and Electronics Engineers, 2016. p. 41-45 7571597 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Yang, S, Orr, B, Guo, Y, Zhang, Y, Pommerenke, D, Shumiya, H, Maeshima, J, Sekine, T, Takita, Y & Araki, K 2016, Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack. in 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016., 7571597, IEEE International Symposium on Electromagnetic Compatibility, vol. 2016-September, Institute of Electrical and Electronics Engineers, pp. 41-45, 2016 IEEE International Symposium on Electromagnetic Compatibility, Ottawa, Canada, 25/07/16. https://doi.org/10.1109/ISEMC.2016.7571597

Yang S, Orr B, Guo Y, Zhang Y, Pommerenke D, Shumiya H et al. Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack. In 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016. Institute of Electrical and Electronics Engineers. 2016. p. 41-45. 7571597. (IEEE International Symposium on Electromagnetic Compatibility). doi: 10.1109/ISEMC.2016.7571597

Yang, Suyu ; Orr, Benjamin ; Guo, Yuangdong et al. / Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack. 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016. Institute of Electrical and Electronics Engineers, 2016. pp. 41-45 (IEEE International Symposium on Electromagnetic Compatibility).

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Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack

Abstract

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Keywords

ASJC Scopus subject areas

Access to Document

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