Manipulating Iron Filament with Permanent Magnets for FDM Printing for X-Band

Jan Köhler, Wolfgang Bösch*, Erich Leitgeb*, Reinhard Teschl*, David Johannes Pommerenke*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference paper

Abstract

This paper presents a novel technique for 3D printing that uses an external magnetic field to direct iron dust mixed into FDM filament. The mobility of the particles during the printing process is exploited to provoke an alignment by means of a static magnetic field. This method offers a completely new possibility to design passive high-frequency components. With very good agreement to the theory a method has been developed, manufactured and was measured within the X-Band.

Translated title of the contributionManipulierung von Eisenfilament mittels Permanentmagnete in FDM-3D-Druck innerhalb des X-Bands
Original languageEnglish
Title of host publicationCoBCom 2020 - International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications - Proceedings
Pages1-8
Number of pages8
ISBN (Electronic)978-1-7281-7492-1
DOIs
Publication statusPublished - Jul 2020
Event3rd International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications: CoBCom 2020 - TU Graz, Virtuell, Graz, Austria
Duration: 7 Jul 202010 Jul 2020
https://www.cobcom.tugraz.at/

Publication series

NameCoBCom 2020 - International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications - Proceedings

Conference

Conference3rd International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications
Abbreviated titleCoBCom 2020
CountryAustria
CityVirtuell, Graz
Period7/07/2010/07/20
Internet address

Keywords

  • 3d print
  • metamaterial
  • composite
  • maniplation
  • Iron
  • iron filament
  • high frequency
  • magnets
  • passive components
  • Fused Filament Fabrication
  • 3D printing
  • X-Band

ASJC Scopus subject areas

  • Instrumentation
  • Hardware and Architecture
  • Computer Networks and Communications
  • Media Technology

Fields of Expertise

  • Information, Communication & Computing
  • Advanced Materials Science

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