Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Abstract

Models of overvoltage protection devices such as voltage suppressor diodes (TVS) are available for the most part in circuit analyzer tools. During the course of investigating the simulation of such protection devices via LTspice in the context of fast transient phenomena some assumptions of those existing models can present problems. This is the case regarding the model of the junction capacitances, especially for the cutoff region when predicting the disturbances generated by those devises.

LanguageEnglish
Title of host publication2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9781538666210
DOIs
StatusPublished - 17 Oct 2018
Event2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 - Long Beach, United States
Duration: 30 Jul 20183 Aug 2018

Conference

Conference2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018
CountryUnited States
CityLong Beach
Period30/07/183/08/18

Fingerprint

Overvoltage protection
Diodes
Capacitance
Networks (circuits)
Electric potential

Keywords

  • electromagnetic compatibility
  • fast transients
  • LTspice
  • overvoltage protection
  • transient voltage suppressors (TVS)
  • voltage suppressor diodes

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Signal Processing
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Bauer, S., Renhart, W., Biro, O., Turk, C., Maier, C., Winkler, G., & Deutschmann, B. (2018). Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. In 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 [8495349] Institute of Electrical and Electronics Engineers. DOI: 10.1109/EMCSI.2018.8495349

Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. / Bauer, Susanne; Renhart, Werner; Biro, Oszkar; Turk, Christian; Maier, Christoph; Winkler, Gunter; Deutschmann, Bernd.

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. Institute of Electrical and Electronics Engineers, 2018. 8495349.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Bauer, S, Renhart, W, Biro, O, Turk, C, Maier, C, Winkler, G & Deutschmann, B 2018, Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. in 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018., 8495349, Institute of Electrical and Electronics Engineers, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018, Long Beach, United States, 30/07/18. DOI: 10.1109/EMCSI.2018.8495349
Bauer S, Renhart W, Biro O, Turk C, Maier C, Winkler G et al. Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. In 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. Institute of Electrical and Electronics Engineers. 2018. 8495349. Available from, DOI: 10.1109/EMCSI.2018.8495349
Bauer, Susanne ; Renhart, Werner ; Biro, Oszkar ; Turk, Christian ; Maier, Christoph ; Winkler, Gunter ; Deutschmann, Bernd. / Investigation of Spice Models for Overvoltage Protection Devices with Respect to Fast Transients. 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018. Institute of Electrical and Electronics Engineers, 2018.
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