@article{6080612b8b9f4abebd74e57a8a930141,
title = "Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests",
author = "C. Hartler and S. Moreau and E. Chery and J. Charbonnier and J. Siegert and A. Plihon and M. Assous and Stefan Mitsche and Sanja Simic and F. Schrank and Werner Grogger",
year = "2018",
doi = "10.1109/TDMR.2018.2834568",
language = "English",
volume = "18",
pages = "313--320",
journal = "IEEE Transactions on Device and Materials Reliability",
issn = "1530-4388",
publisher = "IEEE Press",
number = "2",
}