Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests

C. Hartler; S. Moreau; E. Chery; J. Charbonnier; J. Siegert; A. Plihon; M. Assous; Stefan Mitsche; Sanja Simic; F. Schrank; Werner Grogger

doi:10.1109/TDMR.2018.2834568

Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests

C. Hartler, S. Moreau, E. Chery, J. Charbonnier, J. Siegert, A. Plihon, M. Assous, Stefan Mitsche, Sanja Simic, F. Schrank, Werner Grogger

Institute of Electron Microscopy and Nanoanalysis (5190)

Research output: Contribution to journal › Article

Original language	English
Article number	17822358
Pages (from-to)	313-320
Journal	IEEE Transactions on Device and Materials Reliability
Volume	18
Issue number	2
DOIs	https://doi.org/10.1109/TDMR.2018.2834568
Publication status	Published - 2018

ASJC Scopus subject areas

Materials Science(all)

Fields of Expertise

Advanced Materials Science

Treatment code (Nähere Zuordnung)

Basic - Fundamental (Grundlagenforschung)

Access to Document

10.1109/TDMR.2018.2834568Licence: Unspecified

Cite this

Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests. / Hartler, C.; Moreau, S.; Chery, E.; Charbonnier, J.; Siegert, J.; Plihon, A.; Assous, M.; Mitsche, Stefan ; Simic, Sanja; Schrank, F.; Grogger, Werner.

In: IEEE Transactions on Device and Materials Reliability, Vol. 18, No. 2, 17822358, 2018, p. 313-320.

Research output: Contribution to journal › Article

Hartler, C, Moreau, S, Chery, E, Charbonnier, J, Siegert, J, Plihon, A, Assous, M, Mitsche, S , Simic, S, Schrank, F & Grogger, W 2018, 'Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests', IEEE Transactions on Device and Materials Reliability, vol. 18, no. 2, 17822358, pp. 313-320. https://doi.org/10.1109/TDMR.2018.2834568

Hartler, C. ; Moreau, S. ; Chery, E. ; Charbonnier, J. ; Siegert, J. ; Plihon, A. ; Assous, M. ; Mitsche, Stefan ; Simic, Sanja ; Schrank, F. ; Grogger, Werner. / Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests. In: IEEE Transactions on Device and Materials Reliability. 2018 ; Vol. 18, No. 2. pp. 313-320.

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