Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests

C. Hartler, S. Moreau, E. Chery, J. Charbonnier, J. Siegert, A. Plihon, M. Assous, Stefan Mitsche, Sanja Simic, F. Schrank, Werner Grogger

Research output: Contribution to journalArticle

Original languageEnglish
Article number17822358
Pages (from-to)313-320
JournalIEEE Transactions on Device and Materials Reliability
Issue number2
Publication statusPublished - 2018

ASJC Scopus subject areas

  • Materials Science(all)

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

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