Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests

C. Hartler, S. Moreau, E. Chery, J. Charbonnier, J. Siegert, A. Plihon, M. Assous, Stefan Mitsche, Sanja Simic, F. Schrank, Werner Grogger

Research output: Contribution to journalArticleResearch

Original languageEnglish
Article number17822358
Pages (from-to)313-320
JournalIEEE Transactions on Device and Materials Reliability
Volume18
Issue number2
DOIs
Publication statusPublished - 2018

ASJC Scopus subject areas

  • Materials Science(all)

Fields of Expertise

  • Advanced Materials Science

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests. / Hartler, C.; Moreau, S.; Chery, E.; Charbonnier, J.; Siegert, J.; Plihon, A.; Assous, M.; Mitsche, Stefan; Simic, Sanja; Schrank, F.; Grogger, Werner.

In: IEEE Transactions on Device and Materials Reliability, Vol. 18, No. 2, 17822358, 2018, p. 313-320.

Research output: Contribution to journalArticleResearch

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year = "2018",
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AU - Hartler, C.

AU - Moreau, S.

AU - Chery, E.

AU - Charbonnier, J.

AU - Siegert, J.

AU - Plihon, A.

AU - Assous, M.

AU - Mitsche, Stefan

AU - Simic, Sanja

AU - Schrank, F.

AU - Grogger, Werner

PY - 2018

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JF - IEEE Transactions on Device and Materials Reliability

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