High level fault injection for attack simulation in smart cards

Klaus Rothbart, Ulrich Neffe, Christian Steger, Reinhold Weiß, Edgar Rieger, Andreas Mühlberger

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationProceedings / 13th Asian Test Symposium
Place of PublicationLos Alamitos, Calif.
Publisher.
Pages118-121
ISBN (Print)0-7695-2235-1
Publication statusPublished - 2004
EventAsian Test Symposium - Kenting, Taiwan, Province of China
Duration: 15 Nov 200417 Nov 2004

Conference

ConferenceAsian Test Symposium
CountryTaiwan, Province of China
CityKenting
Period15/11/0417/11/04

Cite this

Rothbart, K., Neffe, U., Steger, C., Weiß, R., Rieger, E., & Mühlberger, A. (2004). High level fault injection for attack simulation in smart cards. In Proceedings / 13th Asian Test Symposium (pp. 118-121). Los Alamitos, Calif.: ..

High level fault injection for attack simulation in smart cards. / Rothbart, Klaus; Neffe, Ulrich; Steger, Christian; Weiß, Reinhold; Rieger, Edgar; Mühlberger, Andreas.

Proceedings / 13th Asian Test Symposium. Los Alamitos, Calif. : ., 2004. p. 118-121.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Rothbart, K, Neffe, U, Steger, C, Weiß, R, Rieger, E & Mühlberger, A 2004, High level fault injection for attack simulation in smart cards. in Proceedings / 13th Asian Test Symposium. ., Los Alamitos, Calif., pp. 118-121, Asian Test Symposium, Kenting, Taiwan, Province of China, 15/11/04.
Rothbart K, Neffe U, Steger C, Weiß R, Rieger E, Mühlberger A. High level fault injection for attack simulation in smart cards. In Proceedings / 13th Asian Test Symposium. Los Alamitos, Calif.: . 2004. p. 118-121
Rothbart, Klaus ; Neffe, Ulrich ; Steger, Christian ; Weiß, Reinhold ; Rieger, Edgar ; Mühlberger, Andreas. / High level fault injection for attack simulation in smart cards. Proceedings / 13th Asian Test Symposium. Los Alamitos, Calif. : ., 2004. pp. 118-121
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