Handling the NDEF Signature Record Type in a Secure Manner

Thomas Korak

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationRFID-Technologies and Applications (RFID-TA), 2012 IEEE International Conference on
PublisherInstitute of Electrical and Electronics Engineers
Pages107-112
Publication statusPublished - 2013
EventIEEE International Conference on RFID-Technologies and Applications - Nizza, France
Duration: 5 Nov 20127 Nov 2012

Conference

ConferenceIEEE International Conference on RFID-Technologies and Applications
CountryFrance
CityNizza
Period5/11/127/11/12

Fields of Expertise

  • Information, Communication & Computing

Treatment code (Nähere Zuordnung)

  • Application

Cite this

Korak, T. (2013). Handling the NDEF Signature Record Type in a Secure Manner. In RFID-Technologies and Applications (RFID-TA), 2012 IEEE International Conference on (pp. 107-112). Institute of Electrical and Electronics Engineers.

Handling the NDEF Signature Record Type in a Secure Manner. / Korak, Thomas.

RFID-Technologies and Applications (RFID-TA), 2012 IEEE International Conference on. Institute of Electrical and Electronics Engineers, 2013. p. 107-112.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Korak, T 2013, Handling the NDEF Signature Record Type in a Secure Manner. in RFID-Technologies and Applications (RFID-TA), 2012 IEEE International Conference on. Institute of Electrical and Electronics Engineers, pp. 107-112, IEEE International Conference on RFID-Technologies and Applications, Nizza, France, 5/11/12.
Korak T. Handling the NDEF Signature Record Type in a Secure Manner. In RFID-Technologies and Applications (RFID-TA), 2012 IEEE International Conference on. Institute of Electrical and Electronics Engineers. 2013. p. 107-112
Korak, Thomas. / Handling the NDEF Signature Record Type in a Secure Manner. RFID-Technologies and Applications (RFID-TA), 2012 IEEE International Conference on. Institute of Electrical and Electronics Engineers, 2013. pp. 107-112
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