Fault state behavior of smart power devices during electromagnetic interference

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Abstract

In this paper the robustness of smart power ICs to electromagnetic interferences (EMI) coupled into their supply and output pins will be shown. In particular, the susceptibility of the integrated protection and diagnosis functionality will be investigated. It will be shown to what extent such devices can correctly detect fault conditions to ensure functional safety, robustness and reliability tasks, if electromagnetic interferences are coupled into their pins.

LanguageEnglish
Title of host publication2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
PublisherInstitute of Electrical and Electronics Engineers
Pages44-49
Number of pages6
ISBN (Electronic)9781509059973
DOIs
StatusPublished - 22 Jun 2018
Event60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 - Suntec City, Singapore
Duration: 14 May 201818 May 2018

Conference

Conference60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
CountrySingapore
CitySuntec City
Period14/05/1818/05/18

Fingerprint

electromagnetic interference
Signal interference
safety
magnetic permeability
output

Keywords

  • Direct power injection
  • Electromagnetic compatibility
  • Electromagnetic interference
  • Functional safety
  • IEC 62132
  • ISO 26262
  • Smart power device

ASJC Scopus subject areas

  • Aerospace Engineering
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Radiation

Fields of Expertise

  • Information, Communication & Computing

Cite this

Deutschmann, B., Kastner, P., & Winkler, G. (2018). Fault state behavior of smart power devices during electromagnetic interference. In 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 (pp. 44-49). Institute of Electrical and Electronics Engineers. DOI: 10.1109/ISEMC.2018.8394033

Fault state behavior of smart power devices during electromagnetic interference. / Deutschmann, Bernd; Kastner, Paul; Winkler, Gunter.

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers, 2018. p. 44-49.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Deutschmann, B, Kastner, P & Winkler, G 2018, Fault state behavior of smart power devices during electromagnetic interference. in 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers, pp. 44-49, 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018, Suntec City, Singapore, 14/05/18. DOI: 10.1109/ISEMC.2018.8394033
Deutschmann B, Kastner P, Winkler G. Fault state behavior of smart power devices during electromagnetic interference. In 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers. 2018. p. 44-49. Available from, DOI: 10.1109/ISEMC.2018.8394033
Deutschmann, Bernd ; Kastner, Paul ; Winkler, Gunter. / Fault state behavior of smart power devices during electromagnetic interference. 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers, 2018. pp. 44-49
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