Exploration of the FlexRay Signal Integrity using a Combined Prototyping and Simulation Approach

Martin Krammer; Federico Clazzer; Eric Armengaud; Michael Karner; Christian Steger; Reinhold Weiß

Exploration of the FlexRay Signal Integrity using a Combined Prototyping and Simulation Approach

Martin Krammer, Federico Clazzer, Eric Armengaud, Michael Karner, Christian Steger, Reinhold Weiß

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Original language	English
Title of host publication	Proceedings of the 13th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems
Publisher	.
Pages	111-116
ISBN (Print)	978-1-4244-6610-8
Publication status	Published - 2010
Event	IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems - Wien, Austria Duration: 14 Apr 2010 → 16 Apr 2010

Conference

Conference	IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems
Country/Territory	Austria
City	Wien
Period	14/04/10 → 16/04/10

Access to Document

2009_E_056.pdfFinal published version, 14.7 KB

1 Finished
1 Active

Hardware/Software-Codesign
Steger, C., Seifert, C., Stelzer, P., Fiala, G. & Basic, F.
1/01/95 → …
Project: Research area
VIF-TEODACS - Testing, Evaluation and Optimization of Dependable Automotive Communication Systems
Karner, M. & Steger, C.
1/03/08 → 31/01/11
Project: Research project

Cite this

Exploration of the FlexRay Signal Integrity using a Combined Prototyping and Simulation Approach. / Krammer, Martin; Clazzer, Federico; Armengaud, Eric et al.
Proceedings of the 13th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems. ., 2010. p. 111-116.

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Krammer, M, Clazzer, F, Armengaud, E, Karner, M, Steger, C & Weiß, R 2010, Exploration of the FlexRay Signal Integrity using a Combined Prototyping and Simulation Approach. in Proceedings of the 13th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems. ., pp. 111-116, IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, Wien, Austria, 14/04/10.

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booktitle = "Proceedings of the 13th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems",

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AU - Krammer, Martin

AU - Clazzer, Federico

AU - Armengaud, Eric

AU - Karner, Michael

AU - Steger, Christian

AU - Weiß, Reinhold

PY - 2010

Y1 - 2010

M3 - Conference paper

SN - 978-1-4244-6610-8

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EP - 116

BT - Proceedings of the 13th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems

PB - .

T2 - IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems

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Exploration of the FlexRay Signal Integrity using a Combined Prototyping and Simulation Approach

Conference

Access to Document

Projects

Hardware/Software-Codesign

VIF-TEODACS - Testing, Evaluation and Optimization of Dependable Automotive Communication Systems

Cite this