ESD susceptibility characterization of an EUT by using 3D ESD scanning system

Kai Wang*, Jayong Koo, Giorgi Muchaidze, David J. Pommerenke

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electrostatic Discharges (ESD) can lead to soft-errors (e.g., bit-errors, wrong resets etc.) in digital electronics. The use of lower threshold voltages and faster I/O increases the sensitivity. In the analysis of ESD problems, an exact knowledge of the affected Pins and Nets is essential for an optimal solution. In this paper, a three dimensional ESD scanning system which has been developed to record the ESD susceptibility map for printed circuit board is presented and the mechanisms that the ESD event couples into the digital devices is studied The ESD susceptibility of a fast CMOS EUT is characterized by generating the susceptibility map of the EUT. A series of measurements of the noise coupled into a sensitive trace and pin during an ESD soft error event are presented.

Original languageEnglish
Title of host publication2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Pages350-355
Number of pages6
DOIs
Publication statusPublished - 1 Dec 2005
Externally publishedYes
Event2005 International Symposium on Electromagnetic Compatibility, EMC 2005 - Chicago, IL, United States
Duration: 8 Aug 200512 Aug 2005

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume2
ISSN (Print)1077-4076

Conference

Conference2005 International Symposium on Electromagnetic Compatibility, EMC 2005
CountryUnited States
CityChicago, IL
Period8/08/0512/08/05

Keywords

  • BSD soft error
  • ESD scanning
  • Susceptibility map
  • TLP

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Wang, K., Koo, J., Muchaidze, G., & Pommerenke, D. J. (2005). ESD susceptibility characterization of an EUT by using 3D ESD scanning system. In 2005 International Symposium on Electromagnetic Compatibility, EMC 2005 (pp. 350-355). [1513538] (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2). https://doi.org/10.1109/ISEMC.2005.1513538