ESD immunity prediction of D flip-flop in the ISO 10605 standard using a behavioral modeling methodology

Guangyao Shen*, Sen Yang, Victor V. Khilkevich, David J. Pommerenke, Hermann L. Aichele, Dirk R. Eichel, Christoph Keller

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

As the ESD stress is becoming more and more important for integrated circuits (ICs), the ability to predict IC failures becomes critical. In this paper, an 18-MHz D flip-flop IC is characterized and its behavioral model is presented. The resulting IC model is validated in the setup according to the ISO 10605 standard. A complete model of the setup combining the IC behavioral model and the passive parts of the setup, including parallel and twisted pair harnesses, is built to estimate the failure prediction accuracy in a totally simulated environment. The results show that the model can predict the failure level with the error of less than 20% in parallel harness case and around 30% in the twisted pair case.

Original languageEnglish
Article number7089237
Pages (from-to)651-659
Number of pages9
JournalIEEE Transactions on Electromagnetic Compatibility
Volume57
Issue number4
DOIs
Publication statusPublished - 1 Aug 2015
Externally publishedYes

Keywords

  • Behavioral model
  • flip-flop
  • ISO 10605
  • parallel harness
  • twisted pair harness

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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