@inproceedings{84bb4a85c481453f9b7f0a99dc956706,
title = "ESD field coupling study in relation with PCB GND and metal chassis",
abstract = "This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.",
author = "Lee, {Jong Sung} and David Pommerenke and Lim, {Jae Deok} and Seol, {Byong Su}",
year = "2009",
month = apr,
day = "16",
doi = "10.1109/EMCZUR.2009.4783413",
language = "English",
isbn = "9783952328668",
series = "Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009",
pages = "153--156",
booktitle = "Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009",
note = "20th International Zurich Symposium on Electromagnetic Compatibility : EMC Zurich 2009 ; Conference date: 12-01-2009 Through 16-01-2009",
}