ESD field coupling study in relation with PCB GND and metal chassis

Jong Sung Lee, David Pommerenke, Jae Deok Lim, Byong Su Seol

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.

Original languageEnglish
Title of host publicationProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Pages153-156
Number of pages4
DOIs
Publication statusPublished - 16 Apr 2009
Externally publishedYes
Event20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009 - Zurich, Switzerland
Duration: 12 Jan 200916 Jan 2009

Publication series

NameProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009

Conference

Conference20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
CountrySwitzerland
CityZurich
Period12/01/0916/01/09

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Lee, J. S., Pommerenke, D., Lim, J. D., & Seol, B. S. (2009). ESD field coupling study in relation with PCB GND and metal chassis. In Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009 (pp. 153-156). [4783413] (Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009). https://doi.org/10.1109/EMCZUR.2009.4783413