Enhancement of the DPI method for IC immunity characterization

Andrea Lavarda, Bernd Deutschmann, Dieter Haerle

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publicationProc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017)
Pages178-183
DOIs
Publication statusPublished - 6 Jul 2017

ASJC Scopus subject areas

  • Engineering(all)

Fields of Expertise

  • Information, Communication & Computing

Treatment code (Nähere Zuordnung)

  • Basic - Fundamental (Grundlagenforschung)

Cite this

Lavarda, A., Deutschmann, B., & Haerle, D. (2017). Enhancement of the DPI method for IC immunity characterization. In Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017) (pp. 178-183) https://doi.org/10.1109/EMCCompo.2017.7998106

Enhancement of the DPI method for IC immunity characterization. / Lavarda, Andrea; Deutschmann, Bernd; Haerle, Dieter.

Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017). 2017. p. 178-183.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Lavarda, A, Deutschmann, B & Haerle, D 2017, Enhancement of the DPI method for IC immunity characterization. in Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017). pp. 178-183. https://doi.org/10.1109/EMCCompo.2017.7998106
Lavarda A, Deutschmann B, Haerle D. Enhancement of the DPI method for IC immunity characterization. In Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017). 2017. p. 178-183 https://doi.org/10.1109/EMCCompo.2017.7998106
Lavarda, Andrea ; Deutschmann, Bernd ; Haerle, Dieter. / Enhancement of the DPI method for IC immunity characterization. Proc. of International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017). 2017. pp. 178-183
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