EMI mitigation with lossy material at 10 GHz

Xiangyang Jiao, Pratik Maheshwari, Victor Khikevich, Paul Dixon, Yoeri Arien, Alpesh Bhobe, Jing Li, Xiao Li, David Pommerenke, James Drewniak, Hamed Kajbaf, Jin Min

Research output: Contribution to journalConference article

Abstract

In this paper, absorber material is utilized to mitigate an EMI problem in real hardware. For a complex and large system, identification of the source location is the first problem which must be solved to achieve electromagnetic interference (EMI) mitigation. Emission Source Microscopy (ESM) provides a powerful tool for locating the sources of radiation in GHz range on a printed circuit board (PCB). Once the source is identified, a suitable volume of the absorber material is placed on the source location to effectively reduce the radiated power at the frequency of interest. Further measurements of the total radiated power in a reverberation chamber are also performed to validate the EMI reduction method with the absorber material.

Original languageEnglish
Article number6898960
Pages (from-to)150-154
Number of pages5
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume2014-September
Issue numberSeptember
DOIs
Publication statusPublished - 15 Sep 2014
Externally publishedYes
Event2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014 - Raleigh, United States
Duration: 3 Aug 20148 Aug 2014

Keywords

  • Absorber material
  • EMI
  • Emission source microscopy
  • Source localization

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'EMI mitigation with lossy material at 10 GHz'. Together they form a unique fingerprint.

  • Cite this

    Jiao, X., Maheshwari, P., Khikevich, V., Dixon, P., Arien, Y., Bhobe, A., ... Min, J. (2014). EMI mitigation with lossy material at 10 GHz. IEEE International Symposium on Electromagnetic Compatibility, 2014-September(September), 150-154. [6898960]. https://doi.org/10.1109/ISEMC.2014.6898960