@inproceedings{87b4da6168cc45d9b88ef5d5bc0490f2,
title = "EMI coupling paths in silicon optical sub-assembly package",
abstract = "Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.",
keywords = "electromagnetic interference (EMI) coupling path, flex PCB, high frequency, total radiated power (TRP)",
author = "Jing Li and Xiao Li and Xiangyang Jiao and Sukhjinder Toor and Ling Zhang and Alpesh Bhobe and James Drewniak and David Pommerenke",
year = "2016",
month = sep,
day = "19",
doi = "10.1109/ISEMC.2016.7571768",
language = "English",
series = "IEEE International Symposium on Electromagnetic Compatibility",
publisher = "Institute of Electrical and Electronics Engineers",
pages = "890--895",
booktitle = "2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016",
address = "United States",
note = "2016 IEEE International Symposium on Electromagnetic Compatibility : EMC 2016 ; Conference date: 25-07-2016 Through 29-07-2016",
}