EMI coupling paths in silicon optical sub-assembly package

Jing Li, Xiao Li, Xiangyang Jiao, Sukhjinder Toor, Ling Zhang, Alpesh Bhobe, James Drewniak, David Pommerenke

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.

Original languageEnglish
Title of host publication2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016
PublisherInstitute of Electrical and Electronics Engineers
Pages890-895
Number of pages6
ISBN (Electronic)9781509014415
DOIs
Publication statusPublished - 19 Sep 2016
Externally publishedYes
Event2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016 - Ottawa, Canada
Duration: 25 Jul 201629 Jul 2016

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
Volume2016-September
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016
CountryCanada
CityOttawa
Period25/07/1629/07/16

Keywords

  • electromagnetic interference (EMI) coupling path
  • flex PCB
  • high frequency
  • total radiated power (TRP)

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'EMI coupling paths in silicon optical sub-assembly package'. Together they form a unique fingerprint.

  • Cite this

    Li, J., Li, X., Jiao, X., Toor, S., Zhang, L., Bhobe, A., ... Pommerenke, D. (2016). EMI coupling paths in silicon optical sub-assembly package. In 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016 (pp. 890-895). [7571768] (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2016-September). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISEMC.2016.7571768