Emerging technologies and concepts for 5G applications - A. making additive manufactured ceramic microwave filters ready for 5G

Sebastian W. Sattler, Fabrizio Gentili, Reinhard Teschl, Carlos Carceller, Wolfgang Bösch

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Abstract

Additive manufacturing (AM) techniques for filter applications have proven to be vital in enabling a variety of forms and shapes best suitable for 5G application. However, in order to guarantee a good RF performance of the passive components, certain aspects have to be taken into account. When it comes to dielectric resonators manufactured in ceramic AM, the quality of the metallization is crucial. Based on a simple prototype, this paper reports on the performance when using an advanced coating technique applied to a 3D printed ceramic body.

Original languageEnglish
Title of host publication2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
PublisherInstitute of Electrical and Electronics Engineers
Pages1-6
Number of pages6
ISBN (Electronic)9781538648254
DOIs
Publication statusPublished - 3 Jul 2018
Event2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018 - Hsinchu, Taiwan, Province of China
Duration: 16 Apr 201819 Apr 2018

Conference

Conference2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018
CountryTaiwan, Province of China
CityHsinchu
Period16/04/1819/04/18

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Electronic, Optical and Magnetic Materials

Cite this

Sattler, S. W., Gentili, F., Teschl, R., Carceller, C., & Bösch, W. (2018). Emerging technologies and concepts for 5G applications - A. making additive manufactured ceramic microwave filters ready for 5G. In 2018 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2018 (pp. 1-6). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/VLSI-TSA.2018.8403809