EMC fundamentals - ESD

David Pommerenke*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Charge separation leads to high voltages, walking, sitting up from a chair and removing a sweater are typical situations Removing a sweater can easily lead to 20kV in dry air System level ESD testing is based on the human-metal ESD ESD testing can be performed in contact and air discharge mode. Contact mode must be applied to conductive surfaces. Failures can be caused by current and by fields. Most damage is caused by current, except, fields can also cause latch up. In most cases TVS are the right choices for overvoltage protection. Soft failure root cause analysis can be performed using local scanning, locally injecting fields from a fast (< 1ns) rise time pulse generator.

Original languageEnglish
Title of host publication2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9781538622308
DOIs
Publication statusPublished - 20 Oct 2017
Externally publishedYes
Event2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Washington, United States
Duration: 7 Aug 201711 Aug 2017

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
CountryUnited States
CityWashington
Period7/08/1711/08/17

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Pommerenke, D. (2017). EMC fundamentals - ESD. In 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings [8078092] (IEEE International Symposium on Electromagnetic Compatibility). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISEMC.2017.8078092