Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band

Sebastian Sattler, Ahmad Bader Alothman Alterkawi, Fabrizio Gentili, Reinhard Teschl, Erich Schlaffer, Bernhard Reitmaier, Wolfgang Bösch

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Original languageEnglish
Title of host publication 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
Publication statusPublished - 2019

Fields of Expertise

  • Information, Communication & Computing

Cite this

Sattler, S., Alothman Alterkawi, A. B., Gentili, F., Teschl, R., Schlaffer, E., Reitmaier, B., & Bösch, W. (2019). Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band. In 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band. / Sattler, Sebastian; Alothman Alterkawi, Ahmad Bader; Gentili, Fabrizio; Teschl, Reinhard; Schlaffer, Erich; Reitmaier, Bernhard; Bösch, Wolfgang.

2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). 2019.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

Sattler, S, Alothman Alterkawi, AB, Gentili, F, Teschl, R, Schlaffer, E, Reitmaier, B & Bösch, W 2019, Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band. in 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP).
Sattler S, Alothman Alterkawi AB, Gentili F, Teschl R, Schlaffer E, Reitmaier B et al. Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band. In 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). 2019
Sattler, Sebastian ; Alothman Alterkawi, Ahmad Bader ; Gentili, Fabrizio ; Teschl, Reinhard ; Schlaffer, Erich ; Reitmaier, Bernhard ; Bösch, Wolfgang. / Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band. 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). 2019.
@inproceedings{110ec14ee217493588ad1af7957d7142,
title = "Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band",
author = "Sebastian Sattler and {Alothman Alterkawi}, {Ahmad Bader} and Fabrizio Gentili and Reinhard Teschl and Erich Schlaffer and Bernhard Reitmaier and Wolfgang B{\"o}sch",
year = "2019",
language = "English",
booktitle = "2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)",

}

TY - GEN

T1 - Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band

AU - Sattler, Sebastian

AU - Alothman Alterkawi, Ahmad Bader

AU - Gentili, Fabrizio

AU - Teschl, Reinhard

AU - Schlaffer, Erich

AU - Reitmaier, Bernhard

AU - Bösch, Wolfgang

PY - 2019

Y1 - 2019

M3 - Conference contribution

BT - 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

ER -