Electromagnetic Emission Scanning at the Surface of ICs

Bernd Deutschmann, Andreas Gleinser, Philipp Reitter

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

With increasing density of components in modern ICs, their electromagnetic compatibility (EMC) becomes more and more a design factor to consider. A lot of interference problems of electronic systems originate form high electromagnetic emission and low immunity of the used ICs. The so-called surface scan method provides a useful measurement technique to highlight origins of emissions
directly at the surface of IC packages or microchips. It is based on measuring electric- as well as magnetic near fields at the surface of ICs by automatically
moving a probe in 3 axis over the device. This technique enables the visualization of the distribution of E- and Hfields emitting from the surface of the device and thereby helps to identify and analyze emission hotspots.
Original languageEnglish
Title of host publication15. EMV-Fachtagung
Subtitle of host publicationOVE Schriftenreihe Nr. 87
EditorsGunter Winkler
Place of PublicationWien
PublisherÖsterreichischer Verband für Elektrotechnik
Pages16
Number of pages1
Volume87
ISBN (Print)3-85133-093-5
Publication statusPublished - 26 Apr 2017

Keywords

  • EMC, Surface Scan, Emission, IC

ASJC Scopus subject areas

  • Engineering(all)

Fields of Expertise

  • Information, Communication & Computing

Fingerprint Dive into the research topics of 'Electromagnetic Emission Scanning at the Surface of ICs'. Together they form a unique fingerprint.

  • Cite this

    Deutschmann, B., Gleinser, A., & Reitter, P. (2017). Electromagnetic Emission Scanning at the Surface of ICs. In G. Winkler (Ed.), 15. EMV-Fachtagung: OVE Schriftenreihe Nr. 87 (Vol. 87, pp. 16). Wien: Österreichischer Verband für Elektrotechnik.